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变化四：新兴先进封测技术的兴起CoWoS先进封装可谓HBM的黄金搭档。随着全球对于高性能计算（HPC）及人工智能（AI）芯片需求的持续增长，也推动了对于台积电CoWoS（Chip on Wafer on Substrate）先进封装产能的需求暴涨，虽然台积电持续扩大产能，但依然难以满足市场需求，成为了限制HPC及AI芯片产能的另一关键瓶颈。这也使得部分客户考虑寻求台积电CoWoS以外的替代方案，其中就包括英特尔的EMIB-T先进封装技术。
1,000+ founders and investors come together at TechCrunch Founder Summit 2026 for a full day focused on growth, execution, and real-world scaling. Learn from founders and investors who have shaped the industry. Connect with peers navigating similar growth stages. Walk away with tactics you can apply immediately
Issuer‑agnostic and composable These credentials can be anchored in multiple ways: Government-issued digital IDs, where available; third‑party identity verifiers similar to visa application centers; employers; or the Linux Foundation itself acting as an issuer.